发明名称 |
Dry flux bonding device and method |
摘要 |
Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated compound layers. The methods described may operate to produce an intermetallic layer that bonds two substrates such as semiconductor wafers together in a relatively efficient and inexpensive manner.
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申请公布号 |
US8492242(B2) |
申请公布日期 |
2013.07.23 |
申请号 |
US20100787187 |
申请日期 |
2010.05.25 |
申请人 |
FAY OWEN;LI XIAO;WOODLAND JOSH;LUO SHIJIAN;GANDHI JASPREET;WU TE-SUNG;MICRON TECHNOLOGY, INC. |
发明人 |
FAY OWEN;LI XIAO;WOODLAND JOSH;LUO SHIJIAN;GANDHI JASPREET;WU TE-SUNG |
分类号 |
H01L33/48;B23K1/20;H01L23/12 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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