发明名称 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce a leakage current between a charge storage layer and a control gate electrode film.SOLUTION: A semiconductor device of a present embodiment comprises: a semiconductor substrate; a memory cell region provided on the semiconductor substrate, in which a plurality of memory cells are formed; and a gate electrode which is formed in the memory cell region via a gate insulation film, and in which a charge storage layer, an interelectrode insulation film and a control gate electrode film are stacked. The gate electrode in the memory cell region is formed such that a cavity is formed between a top face of the charge storage layer and the interelectrode film.
申请公布号 JP2013143482(A) 申请公布日期 2013.07.22
申请号 JP20120003013 申请日期 2012.01.11
申请人 TOSHIBA CORP 发明人 TAKEKIDA HIDEHITO
分类号 H01L21/8247;H01L21/336;H01L27/10;H01L27/115;H01L29/423;H01L29/49;H01L29/788;H01L29/792 主分类号 H01L21/8247
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