| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting strength of a semiconductor device.SOLUTION: A lead T2 exposed from a lower surface 6b of a sealing body 6 sealing a semiconductor chip has a part (first part) 4a formed to a first thickness and a part (second part) 4b formed to a second thickness smaller than the first thickness. The part 4b is placed between the part 4a and a chip mount part, and formed integrally with the part 4a. A side face 4c is placed at a border between the part 4a and the part 4b. A groove M1 is formed adjacently to the side face 4c of the part 4a, for example, by irradiation with laser light LZ, and the side face 4c and a lower surface 4bb of the part 4b are exposed from the sealing body 6. |
