| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a device which, when firing a metal film formed on a substrate, satisfactorily prevents the metal film from being peeled off from a base to avoid an etching failure, thereby allowing good patterning.SOLUTION: A flattening film 2, a metal material layer 3'X, a transparent conductive film 4X, and a metal oxide film 5X are sequentially laminated on a surface of a TFT substrate 1. Thereafter, a step of firing the metal material layer 3'X is performed at a treatment temperature higher than those in steps before the step. The metal material layer 3'X is reinforced by the transparent conductive film 4X and the metal oxide film 5X, thereby preventing air bubbles due to moisture derived from the flattening film 2 from being generated between the flattening film 2 and the metal material layer 3'X. |
