SEMICONDUCTOR EQUIPMENT

摘要

PURPOSE: Semiconductor equipment is provided to increase an operation speed by including a transfer device which bidirectionally transfers a substrate. CONSTITUTION: A transfer device is located on a die attaching device and a wire bonding device. The transfer device includes a rail (210), a movable structure mounted on the rail, and a support structure mounted on the movable structure. The movable structure includes a slider (221) which moves on the rail and a driving motor (222) attached to one side of the slider. The support structure mounts a substrate (400). The support structure includes a first mounting unit (231), a second mounting unit (232), and a fixing unit (233).