| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can inhibit plastic deformation of an electrode in a stacking process while inhibiting warp of a chip due to heat stress and ensuring bondability with an underfill filled between chips; provide a semiconductor chip for the semiconductor device; and further provide a manufacturing method of the same.SOLUTION: In a semiconductor device in which a plurality of semiconductor chips 10 are stacked, each semiconductor chip includes a pattern part 13, a resin layer 17 on the pattern part 13 and a through electrode 14 on a surface, and includes bump parts 11, 12 on upper and lower surfaces of the through electrode. The plurality of semiconductor chips are stacked and connected such that the bump parts of the neighboring semiconductor chips are opposed to each other. Further in the semiconductor device, a rear face resin layer 16 is formed on a rear face of each semiconductor chip in a region other than regions of a bump 12 on an undersurface side, and an underfill that is a resin material is filled between the semiconductor chips which are stacked by the bumps 11, 12. |
