发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board which enhances mechanical strength of a bottom of a recessed part for component mounting, thereby improving the reliability.SOLUTION: In a printed wiring board (10), an insulation layer (16) is formed on one of front and rear surfaces of a metal core (11), and the printed wiring board (10) uses an opening (12) formed in the metal core as a recessed part (15a) for component mounting. In the printed wiring board (10), a reinforcement pattern (30) is formed on a surface portion of the insulation layer which faces a portion forming a bottom of the recessed part (15a). The reinforcement pattern (30) is formed concurrently with wiring patterns (28c, 29c) formed at the insulation layer (16) using the same material as the wiring patterns (28c, 29c).
申请公布号 JP2013141028(A) 申请公布日期 2013.07.18
申请号 JP20130085440 申请日期 2013.04.16
申请人 TAIYO YUDEN CO LTD 发明人 YOKOTA HIDEKI;MIYAZAKI MASASHI
分类号 H05K3/46 主分类号 H05K3/46
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