| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging structure of a light emitting diode having excellent heat radiation efficiency.SOLUTION: A packaging structure of a light emitting diode according to this invention includes: a heat conduction substrate; a light emitting diode die installed on the heat conduction substrate; and a sealing body allowing the light emitting diode die to be mounted on the heat conduction substrate. A metal eutectic layer, formed by making eutectic junction of a metal layer plated on the light emitting diode die and another metal layer plated on the heat conduction substrate, is installed between the light emitting diode die and the heat conduction substrate. |
