发明名称 INSULATIVE MATERIAL, MULTILAYER FILM, LAMINATE, CONNECTION STRUCTURE, MANUFACTURING METHOD OF LAMINATE, AND MANUFACTURING METHOD OF CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an insulative material which offers good laminatability or easiness of pickup because of having less surface stickiness, and which allows the alignment between electrodes because of its high transparency.SOLUTION: An insulative material according to the invention is used on a first connection target member 2 having a plurality of first protruding electrodes 2b on a surface 2a thereof in such a way that it is placed over the first electrodes 2b and gaps X therebetween to cover the first electrodes 2b. The insulative material is shaped in a film form. The insulative material has a haze value of 70% or smaller. As to the insulative material, the surface probe tack measured by use of a 5-mm&phgr; probe at 25°C is 500 mN/5 mm&phgr; or smaller.
申请公布号 JP2013140756(A) 申请公布日期 2013.07.18
申请号 JP20120001117 申请日期 2012.01.06
申请人 SEKISUI CHEM CO LTD 发明人 NAKAYAMA ATSUSHI;ISHIZAWA HIDEAKI;ENAMI TOSHIO;HATAI MUNEHIRO
分类号 H01B17/56;B32B7/02;C09D5/25;C09D7/12;C09D163/00;C09D201/00;C09J5/00;C09J9/02;C09J201/00;H01B5/16;H01R11/01 主分类号 H01B17/56
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