| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive resin composition to exhibit a low volume resistivity (high conductivity) by the addition of the small amount of a conductive particle.SOLUTION: An electroconductive liquid resin composition includes: an epoxy resin (A); a curing agent (B) in an amount in which an amount of an epoxy group and a reactive group in the curing agent (B) to 1 equivalent of an epoxy group in the epoxy resin (A) is 0.8 to 1.25 equivalents; a curing promoter (C) in an amount of 0.05 to 10 parts by mass, based on 100 parts by mass of the total of the resin (A) and the agent (B); an electroconductive filler (D) in an amount of 300 to 1,000 parts by mass, based on 100 parts by mass of the total of the resin (A) and the agent (B); and particles of a thermoplastic resin (E) which is solid at 25°C in an amount of 3 to 50 parts by mass, based on 100 parts by mass of the total of the resin (A) and the agent (B), wherein when the composition (E) is heated, an average diameter of the particles after heated becomes at least 1.5 times an average diameter of the particles before heated. |
