| 摘要 |
<p>The present invention relates to an integrated semiconductor-processing apparatus including: an integrated semiconductor-processing body which has a first space for storing a plurality of FOUPs containing a plurality of wafers, and a second space in which a processing device is installed to process the wafers stored in the first space; a load port module installed in the first space of the integrated semiconductor-processing body to open the FOUPs to enable extraction of wafers from the FOUPs; and a transfer device which extracts wafers from the FOUPs and transfers the wafers to the processing device in the second space.</p> |
