Micromechanical acceleration sensor for low frequency applications, has movable element which is connected with substrate by spring element, where thermo element is firmly connected with substrate

摘要

The micromechanical acceleration sensor (100) has a movable element (200) which is connected with a substrate by a spring element (230). A thermo element (300) is firmly connected with the substrate. The movable element has a heating element (220). A deflection of the movable element causes a change of the distance between the heating element and the thermo element. Two silicon layers are arranged on the substrate and are partially insulated from each other. The silicon layers have similar doping and different charge carrier densities.