| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of reducing characteristic deterioration of a wafer due to variations in the temperature of a lamp heater.SOLUTION: A heat treatment apparatus 1 according to the present invention includes a chamber 11, a susceptor 12, a lamp heater 13, and a light shielding plate 14. The susceptor 12 supports a wafer W inside the chamber 11. The lamp heater 13 heats the wafer W supported by the susceptor 12. The light shielding plate 14 is disposed between the wafer W and the lamp heater 13 and adjusts a heating temperature for the wafer W. |
