| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating film having good solder wettability and a method for forming the same with which there is no twisting of the plating film, and discoloration is controlled, even after reflow treatment of a tin or tin alloy plating film used in electronic components.SOLUTION: A tin film on a surface of a substrate is treated with an aqueous solution containing L-arginine and having a pH of 7 to 12 before the reflow treatment, and then the tin film is subjected to the reflow treatment. |
