| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor power conversion device that has a compact device size and thus a reduced wiring inductance between a semiconductor power conversion module and a capacitor.SOLUTION: In the power conversion device configured so that semiconductor power conversion modules are mounted on both opposite surfaces of a cooler, respectively, and a smoothing capacitor is electrically connected to the semiconductor power conversion modules mounted on the cooler, a positive terminal and a negative terminal are disposed on each of both opposite surfaces of the capacitor, and the positive terminal and the negative terminal on each surface of the capacitor are electrically connected via connecting conductors, respectively, to a positive terminal and a negative terminal of the semiconductor power conversion module mounted on the cooler which is on the same plane as the surface of the capacitor where the positive terminal and the negative terminal are disposed. |
