发明名称 |
SILICON PHOTONIC CHIP OPTICAL COUPLING STRUCTURES |
摘要 |
A silicon photonic chip is provided. An active silicon layer that includes a photonic device is on a front side of the silicon photonic chip. A silicon substrate that includes an etched backside cavity is on a backside of the silicon photonic chip. A microlens is integrated into the etched backside cavity. A buried oxide layer is located between the active silicon layer and the silicon substrate. The buried oxide layer is an etch stop for the etched backside cavity.
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申请公布号 |
US2013182998(A1) |
申请公布日期 |
2013.07.18 |
申请号 |
US201213353118 |
申请日期 |
2012.01.18 |
申请人 |
ANDRY PAUL S.;BUDD RUSSELL A.;LIBSCH FRANK R.;WISNIEFF ROBERT L.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDRY PAUL S.;BUDD RUSSELL A.;LIBSCH FRANK R.;WISNIEFF ROBERT L. |
分类号 |
G02B6/42;G02B6/32 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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