发明名称 COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING SAME
摘要 <p>There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.</p>
申请公布号 EP2614904(A1) 申请公布日期 2013.07.17
申请号 EP20110828827 申请日期 2011.09.12
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 KANESHIRO, YUKI;SUENAGA, SHINICHI;FUJITA, HIDEFUMI;KISHIDA, MINORU
分类号 B22F9/24;B22F1/00;B22F9/20;H01B1/22;H01B5/00;H01B13/00 主分类号 B22F9/24
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