发明名称 |
COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.</p> |
申请公布号 |
EP2614904(A1) |
申请公布日期 |
2013.07.17 |
申请号 |
EP20110828827 |
申请日期 |
2011.09.12 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
KANESHIRO, YUKI;SUENAGA, SHINICHI;FUJITA, HIDEFUMI;KISHIDA, MINORU |
分类号 |
B22F9/24;B22F1/00;B22F9/20;H01B1/22;H01B5/00;H01B13/00 |
主分类号 |
B22F9/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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