| 摘要 |
An apparatus for attaching a peeling tape is provided to avoid the generation of a line or crack on a wafer by stopping a peeling tape attaching unit when a pressure value between a wafer surface protection film and the peeling tape attaching unit is not lower than a predetermined value. While a surface protection film(11) attached to the front surface of a wafer(20) faces upward, the wafer is placed on a table(31). When a peeling tape attaching unit is lowered, peeling tape(4) is pressurized to the surface protection film to attach the peeling tape to the surface protection film. A pressure between the surface protection film of the wafer and the peeling tape attaching unit is detected. When the detected pressure value is not lower than a predetermined value, the peeling tape attaching unit stops.
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