发明名称 Assembly and method for pre-heating circuit boards for thermoforming
摘要 <p>The invention relates to a plant (10) for hot forming blanks (P), comprising at least one preheating device (2) and at least one main heating device (4), which is arranged downstream from the at least one preheating device (2). The preheating device (2) encompasses at least one, in particular pre-mixing, burner, which is embodied as hydrogen-oxygen burner, fuel gas-oxygen burner or acetylene burner.</p>
申请公布号 EP2615396(A1) 申请公布日期 2013.07.17
申请号 EP20120008168 申请日期 2012.12.06
申请人 LINDE AKTIENGESELLSCHAFT 发明人 BORS, MATTHIAS
分类号 F27B9/02;B21J1/06;C21D9/00;C21D9/46;C21D9/48;F27B9/14;F27B9/24;F27B9/36 主分类号 F27B9/02
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