| 摘要 |
A thermal conduit (140) to extract heat from an electrical component (120) on a circuit board (105) is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit (120) mounted on a circuit board (105) and a thermal conduit (140) having a first (140A) and a second portion (140B). The first portion (140A) of the thermal conduit is thermally coupled to one or more electrical terminals (130) of the integrated circuit (120) through an opening (135) defined in the circuit board while the second portion (140B) of the thermal conduit (140) is thermally coupled to a first material (115) of the circuit board (105). |
