| 摘要 |
PURPOSE: A wafer and a manufacturing method thereof are provided to bond unit wafers by using fine align patterns and to streamline the manufacturing process. CONSTITUTION: A pattern(101) of a predetermined shape is formed. A pair of unit wafers(W1,W2) corresponding to the pattern bond. An align part(110) aligns the pair of unit wafers by applying electro-magnetic principle. One of a pair of unit wafers has the first align pattern. |
