FILM LAMINATING APPARATUS

摘要

PURPOSE: A film bonding device is provided to effectively process junction with a large size film by effectively moving the location of junction films. CONSTITUTION: A bonding device (1) attaching films comprises a first transfer module (30) transferring a first film sheet of a strip-shaped separator at the surface of a first film; a second transfer unit (90) transferring a second film sheet of the strip-shaped separator at the surface of a long second film; a half cut processing unit (40) cuts the first film as a predetermined size; and a peeling unit (50) peels the first film from the separator with a blade. A splicer (63) supports the first film. A transfer stand is moved between the peeling unit and a junction space of the first film and a second film. A transfer device (7) guides the junction stand to face to the first and the second film. A junction station (80) separates the first film from a second film sheet.