| 摘要 |
PURPOSE: A polishing apparatus and a control device thereof are provided to increase the lifetime of the polishing apparatus by preventing stress in the polishing apparatus. CONSTITUTION: An upper plate (2) and a lower plate (1) are prepared. An outer gear (3) and an inner gear (4) are formed on the outer and inner sides of the lower plate respectively. A plurality of carriers (5) are located between the inner gear and the outer gear. At least one wafer is supported by the carrier. A slurry supply hole (6) is uniformly formed on the upper plate. Slurry is supplied to the slurry supply hole.
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