| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity, which allows formation of a fine pattern and gives a cured coating film that is excellent in flexibility, insulating property, adhesion property and the like and is to be suitably used for a photo-solder resist.SOLUTION: The photosensitive resin composition includes a carboxyl group-containing photosensitive ester resin (A), at least one compound (B) selected from an epoxy group-containing compound, a non-blocked isocyanate compound or the like, and a photopolymerization initiator (C). The resin (A) is a compound obtained through steps of: producing a half ester compound (c) by reacting a polyol compound (a) with a tetrabasic acid dianhydride (b); generating a hydroxyl-group containing photosensitive ester resin (e) by reacting the half ester compound (c) with a compound (d) having an epoxy group or an oxetane group, and an ethylenically unsaturated group; and then reacting the hydroxyl group-containing photosensitive ester resin (e) with a dibasic acid anhydride (f). |
