发明名称 CU/AL CLAD MATERIAL WITH HIGH STRENGTH AND INTERFACIAL RELIABILITY THROUGH ALLOYING, AND THE METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A cooper or aluminum cladded material is provided to offer excellent electronic characteristics and intensity by increasing the intensity without reducing conductivity in a copper material or an aluminum material. CONSTITUTION: A cladded material has a lamination structure in which copper materials and aluminum material are laminated. The copper material comprises an alloy element selected from an alloy element group comprising Cr, Zr, Ag, Mg, Mn, Ti, Nb, Fe, and Co and another alloy element selected from the alloy element group comprising Cr, Zr, Ag, Mg, Mn, Ti, Nb, Fe, Co, and Si. The content of the alloy element includes the Cu base is the 0.01-10 weight % of Ag, Nb, Fe, and Cr or the 0.01-5 weights % of Zr, Mg, Mn,Ti, and Co. [Reference numerals] (10) Cu alloy; (20) AI alloy
申请公布号 KR20130079905(A) 申请公布日期 2013.07.11
申请号 KR20120000666 申请日期 2012.01.03
申请人 THE INDUSTRY & ACADEMIC COOPERATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC) 发明人 HONG, SUN IG;KIM, HO BYEONG;OH, GI HWAN
分类号 B32B15/20;B23K20/00 主分类号 B32B15/20
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