| 摘要 |
PURPOSE: A method and an apparatus for bonding a die on a substrate are provided to perform a bonding process on a wafer having two kinds of dies in one place and to reduce the time for manufacturing a semiconductor device. CONSTITUTION: A die ejector (120) is arranged beneath a stage unit. A die picker (130) is arranged in the upper part of the stage unit. A temporary support unit (140) is adjacent to the stage unit. A transfer unit (151) is arranged at both sides of the stage unit. A bonding head unit bonds the die to a substrate.
|
