A method of manufacturing a MEMS device comprises forming a MEMS device element (14). A sacrificial layer (20) is provided over the device element and a package cover layer (22) is provided over the sacrificial layer. The sacrificial layer is removed using at least one opening (22) in the cover layer and the at least one opening (24) is sealed by an anneal process.
申请公布号
US8481365(B2)
申请公布日期
2013.07.09
申请号
US20090995100
申请日期
2009.05.19
申请人
VERHELIJDEN GREJA J. A. M.;MEUNIER-BEILLARD PHILIPPE;DONKERS JOHANNES J. T. M.;NXP B.V.
发明人
VERHELIJDEN GREJA J. A. M.;MEUNIER-BEILLARD PHILIPPE;DONKERS JOHANNES J. T. M.
