| 摘要 |
PROBLEM TO BE SOLVED: To pull and recover a larger quantity of a purified semiconductor or a purified metal.SOLUTION: A cooling body 100 includes a hollow rotary shaft portion 120 and a hollow immersion portion 110 which communicates with the rotary shaft portion 120 and is immersed in a molten semiconductor or a molten metal. The immersion portion 110 comprises a cylindrical peripheral face and a curved bottom face contiguous to the peripheral face. A pipe 130 for passing a cooling fluid to cool the cooling body 100 is disposed within the rotary shaft portion 120. A spouting portion 140 which communicates with the pipe 130 and has a plurality of outlets 141 for spouting the cooling fluid toward the inner surface of the immersion portion 110 is disposed within the immersion portion 110. The plurality of outlets 141 are located in the lateral face and bottom face of the spouting portion 140. The distance Lbetween the upper end position of upper end outlets located uppermost among the plurality of outlets 141 located in the lateral face of the spouting portion 140 and the lower end position of the immersion portion 110 is equal to or less than half the distance Lbetween the upper end position of the immersion portion 110 and the lower end position of the immersion portion 110. |
