| 摘要 |
PURPOSE: A metal junction ceramic substrate is provided to maintain a proper range of power required for processes by controlling the width or length of a metal layer. CONSTITUTION: A circuit pattern is formed by joining a metal layer(20) on one or both sides of a ceramic substrate(10). The metal layer is formed with a direct junction method that directly joins a copper plate to a substrate. An additional metal layer(22), including no circuit pattern is formed on the outer side of the metal layer in order to enhance the hardness of the ceramic substrate. A rectangular edge part(24) is formed on the edge of the additional metal layer. A connection part(26) connects the edge part to the additional metal layer. |
