发明名称 |
BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND FABRICATING METHOD THEREOF |
摘要 |
A bump structure includes a substrate, a pad, an electrode and a protruding electrode. The pad is disposed on the substrate. The electrode is formed by a first metal material and disposed on the pad. The protruding electrode is formed by a second metal material and disposed on the electrode, wherein a cross-sectional area of the protruding electrode is less than a cross-sectional area of the electrode.
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申请公布号 |
US2013168851(A1) |
申请公布日期 |
2013.07.04 |
申请号 |
US201213484289 |
申请日期 |
2012.05.31 |
申请人 |
LIN YU-MIN;ZHAN CHAU-JIE;CHANG TAO-CHIH;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
LIN YU-MIN;ZHAN CHAU-JIE;CHANG TAO-CHIH |
分类号 |
H01L23/498;H01L21/28 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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