发明名称 A METHOD OF MOULDING
摘要 <p>A method comprising: patterning one or more electrical layers on a substrate (205); shaping the patterned substrate (205) into a 3-dimensional contour, wherein the contour including a significant change in gradient in or adjacent to one or more sensing areas of the electrical layer-, and over-moulding the shaped substrate (205), wherein degradation of a trace (509) in the electrical layer at or adjacent to the one or more sensing areas during shaping and/or over-moulding is substantially minimised based on the width of the trace (509), the thickness or number of layers of the trace (509), the bending radius of the trace (509), the material of the trace (509), and/or a primer over layer on the trace (509).</p>
申请公布号 WO2013058708(A8) 申请公布日期 2013.07.04
申请号 WO2012SG00379 申请日期 2012.10.09
申请人 LEONG, CHEE SENG;CHUA, SZE LAM;FISCHER TECHNOLOGY PTE. LTD. 发明人 LEONG, CHEE SENG;CHUA, SZE LAM
分类号 B32B27/08;B29C45/14;B32B37/18;H03K17/96 主分类号 B32B27/08
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