| 摘要 |
PROBLEM TO BE SOLVED: To achieve downsizing or cost reduction of a high-frequency power amplifier module that performs power detection.SOLUTION: A high-frequency power amplifier module includes, for example, high-frequency power amplifiers HPA1 and HPA2 amplifying signals with different frequency bands (low bandwidth and high bandwidth), a power-detection circuit block DETBK, and capacitance C1 and C2. An output of the HPA1 is coupled to an input of the DETBK via the C1, and an output of the HPA2 is coupled to the input of the DETBK via the C2. The HPA1 and the C1 are formed on the same semiconductor chip, the HPA2 and the C2 are formed on the same semiconductor chip. |
