| 摘要 |
PROBLEM TO BE SOLVED: To provide a plated product with excellent slidability, in which a plating film is formed on a substrate comprising a conductive metal.SOLUTION: The plated product is provided, in which a plating film is formed on a substrate comprising a conductive metal, wherein a porous plating layer is formed on the substrate, while the surface of the plating film has a number of pores, and also the pores are filled with lubricative particles by blasting. Preferably, the porous plating layer includes Ni or Cu as the main component. Also, a mean diameter of the pore is preferably 0.2-20 μm in area weighted average efficiency. |
