发明名称 |
ADHESIVE COMPOSITION FOR TEMPORARILY BONDING USE IN WAFER MANUFACTURING |
摘要 |
The present invention discovers a temporarily bonded adhesive composition used in wafer manufacturing, the production method and use thereof. The adhesive composition comprises a component A and a component B, wherein the component A comprises an epoxy resin; and the component B comprises a thiol, a amine and water soluble polymer. |
申请公布号 |
WO2013097761(A1) |
申请公布日期 |
2013.07.04 |
申请号 |
WO2012CN87801 |
申请日期 |
2012.12.28 |
申请人 |
HENKEL (CHINA) COMPANY LIMITED |
发明人 |
LI, LEO;ATTARWALA, SHABBIR |
分类号 |
C09J163/00;C09J131/04;C09J139/06 |
主分类号 |
C09J163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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