| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board that compactly implements a satisfactory high frequency characteristic.SOLUTION: The circuit board includes: a laminated substrate 22 formed by a laminate of conductive layers 40, 42 and 44 and insulating layers 30, 32, 34, 36 and 38; a transmission filter chip 10a and a reception filter chip 10b built in the laminated substrate 22; and an active component 16a disposed on an upper surface of the laminated substrate 22 so as to at least partly overlap a projection area 10c formed by projection of the transmission filter chip 10a in a thickness direction of the laminated substrate 22, and connected to the transmission filter chip 10a. |
