发明名称 |
MICROELECTRONIC DEVICE, STACKED DIE PACKAGE AND COMPUTING SYSTEM CONTAINING SAME, METHOD OF MANUFACTURING A MULTI¬ CHANNEL COMMUNICATION PATHWAY IN SAME, AND METHOD OF ENABLING ELECTRICAL COMMUNICATION BETWEEN COMPONENTS OF A STACKED-DIE PACKAGE |
摘要 |
A microelectronic device comprises a first surface (110, 710), a second surface (120, 720), and a passageway (130, 730) extending from the first surface to the second surface. The passageway contains a plurality of electrically conductive channels (131, 132, 231, 232) separated from each other by an electrically insulating material (133, 1 133). |
申请公布号 |
WO2012174449(A3) |
申请公布日期 |
2013.07.04 |
申请号 |
WO2012US42774 |
申请日期 |
2012.06.15 |
申请人 |
INTEL CORPORATION;CHEAH, BOK ENG;PERIAMAN, SHANGGAR;OOI, KOOI CHI |
发明人 |
CHEAH, BOK ENG;PERIAMAN, SHANGGAR |
分类号 |
H01L23/538;H01L23/48 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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