METHOD FOR REMOVING SOLDER BALLS FROM CHIP

摘要

A method for removing solder balls (103) from a chip (102) comprises: immersing a chip (102) provided with solder balls (103) in a corrosive solution, the corrosive solution being prepared with a nitric acid solution having a concentration of 70% and deionized water at a volume ratio of 1:1 (301); taking out the chip (102) for rinsing (302); and placing the chip (102) in a container filled with water for ultrasonic oscillation cleaning (303). The corrosive solution prepared with a nitric acid solution having a concentration of 70% and deionized water at a volume ratio of 1:1 can completely remove the solder balls (103) from the surface of the chip (102) without affecting pads (201).