APPARATUS OF BONDING SEMICONDUCTOR CHIP

摘要

PURPOSE: An apparatus for bonding a semiconductor chip is provided to improve productivity by simplifying a multi stack package process. CONSTITUTION: A transfer rail transfers a substrate. A loading member (120a,120b) loads the substrate. An unloading member (130a,130b) unloads the substrate. A first wafer supply unit supplies a first wafer including a first semiconductor chip. A bonding unit (150a,150b) attaches the first semiconductor chip to the substrate.