发明名称 |
Assemblies and methods for dissipating heat from handheld electronic devices |
摘要 |
According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a thermally conductive structure which comprises elastomer may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally conductive structure which comprises elastomer.
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申请公布号 |
US8477499(B2) |
申请公布日期 |
2013.07.02 |
申请号 |
US201113164653 |
申请日期 |
2011.06.20 |
申请人 |
HILL RICHARD F.;RIAZ SHAHI;LAIRD TECHNOLOGIES, INC. |
发明人 |
HILL RICHARD F.;RIAZ SHAHI |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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