发明名称 |
PRINTED CIRCUIT BOARD FOR CHIP ON BOARD TYPE LIGHT EMITTING DIODE MODULE |
摘要 |
<p>PURPOSE: A PCB for a COB type LED module using high reflective aluminum which is insulated and coated with heat radiation as a base plate is provided to improve the efficiency of light from an LED chip over 10% by forming a plurality of high reflective layers on the surface of an anodized aluminum plate to be overlapped. CONSTITUTION: An LED chip (11) is attached to a base plate (12). The base plate is composed of an anodized aluminum plate (20). An insulation layer (30) is formed on the upper side of the anodized aluminum plate. A heat radiation layer (40) is formed on the lower side of the anodized aluminum plate. A high reflective layer (50) includes a first reflective layer (52) composed of a titanium oxide thin film and a second reflective layer (54) coated with aluminum or silver.</p> |
申请公布号 |
KR101280662(B1) |
申请公布日期 |
2013.07.01 |
申请号 |
KR20130003245 |
申请日期 |
2013.01.11 |
申请人 |
JOONG ANG SAN UP CO., LTD. |
发明人 |
PARK, JONG KWAN |
分类号 |
H01L33/64;F21S2/00;F21V29/00;H05K7/20 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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