发明名称 PRINTED CIRCUIT BOARD FOR CHIP ON BOARD TYPE LIGHT EMITTING DIODE MODULE
摘要 <p>PURPOSE: A PCB for a COB type LED module using high reflective aluminum which is insulated and coated with heat radiation as a base plate is provided to improve the efficiency of light from an LED chip over 10% by forming a plurality of high reflective layers on the surface of an anodized aluminum plate to be overlapped. CONSTITUTION: An LED chip (11) is attached to a base plate (12). The base plate is composed of an anodized aluminum plate (20). An insulation layer (30) is formed on the upper side of the anodized aluminum plate. A heat radiation layer (40) is formed on the lower side of the anodized aluminum plate. A high reflective layer (50) includes a first reflective layer (52) composed of a titanium oxide thin film and a second reflective layer (54) coated with aluminum or silver.</p>
申请公布号 KR101280662(B1) 申请公布日期 2013.07.01
申请号 KR20130003245 申请日期 2013.01.11
申请人 JOONG ANG SAN UP CO., LTD. 发明人 PARK, JONG KWAN
分类号 H01L33/64;F21S2/00;F21V29/00;H05K7/20 主分类号 H01L33/64
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