PCB(PRINTED CIRCUIT BOARD) FOR MUF(MOLDED UNDERFILL) AND MOLDING STRUCTURE OF THE SAME PCB

摘要

PURPOSE: A PCB for molded underfill (MUF) and a PCB molding structure thereof are provided to prevent the leakage of sealing materials by not forming a guide ring around a bent part on the PCB. CONSTITUTION: A molding area (Marea) includes an active area (Aarea) in which semiconductor chips is mounted. The active area is arranged to slant toward a y direction in the molding area. Multiple chip mounting parts (ch) with the mounted semiconductor chips are arranged in the active area. A peripheral area (Parea) is arranged around the molding area. A guide hole (GH) is formed at four corners of the peripheral area.