发明名称 HIGH DENSITY JACK
摘要 The present disclosure provides for electrical connectors or jack assemblies/housings for use in voice/data communication systems. More particularly, the present disclosure provides for modular jack assemblies that include a movable locking member. The present disclosure provides for improved systems/designs for jack assemblies/housings that are easily secured and/or unsecured to or from a jack panel or jack faceplate. In exemplary embodiments, the present disclosure provides for convenient, low-cost and effective systems and methods for easily securing and/or unsecuring jack assemblies/housings to or from a jack panel/faceplate (e.g., in the field) by utilizing advantageous modular jack assemblies that include a movable locking member, and related assemblies.
申请公布号 SG188982(A1) 申请公布日期 2013.06.28
申请号 SG20130018528 申请日期 2011.09.08
申请人 ORTRONICS, INC. 发明人 DIETZ, WILLIAM, H.;CUPPLES, KENNETH, A.;SCHLUETER, RICHARD, W.
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