发明名称 System and Method For Use Case-Based Thermal Analysis of Heuristically Determined Component Combinations and Layouts In A Portable Computing Device
摘要 Various embodiments of methods and systems for heuristic determination and thermal analysis of component placement on a printed circuit board ("PCB") for use in a portable computing device ("PCD") are disclosed. It is an advantage of embodiments that thermal energy generating components, such as processors, may be heuristically selected and arranged on a selected PCB according to varying layouts and combinations and then evaluated for thermal dissipation efficiency under an assortment of use case scenarios. In this way, users of the system and method may quickly narrow down commercially feasible component layouts, identify the most efficient layouts and then heuristically modify the layouts to develop an optimal arrangement.
申请公布号 US2013167103(A1) 申请公布日期 2013.06.27
申请号 US201213537309 申请日期 2012.06.29
申请人 BURRELL JAMES D.;BAO ZHONGPING;CHENG LIANG;GASTELUM DAMION B.;GOOD GARY D.;TANTOUSH MOHAMMED A.;ANDERSON JON J.;QUALCOMM INCORPORATED 发明人 BURRELL JAMES D.;BAO ZHONGPING;CHENG LIANG;GASTELUM DAMION B.;GOOD GARY D.;TANTOUSH MOHAMMED A.;ANDERSON JON J.
分类号 G06F17/50 主分类号 G06F17/50
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