| 发明名称 |
THERMOSETTING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC PARTS USING THEM |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that strikes a balance between high thermostability and high thermal conductivity; and to provide a powdery sealing material and electronic parts, each using the same. <P>SOLUTION: The thermosetting resin composition contains: (A) a thermosetting resin having an imide skeleton in a molecule and an allyl group as a functional group; (B) a maleimide compound; and (C) an inorganic filler. The inorganic filler contains more than 80 mass%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013127022(A) |
申请公布日期 |
2013.06.27 |
| 申请号 |
JP20110276578 |
申请日期 |
2011.12.19 |
| 申请人 |
PANASONIC CORP |
发明人 |
BABA DAIZO;SAWADA TOMOAKI |
| 分类号 |
C08L79/08;C08K3/00;C08K5/3412;H01L23/29;H01L23/31 |
主分类号 |
C08L79/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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