发明名称 PRESSURE BUFFERING APPARATUS, LIQUID EJECTION HEAD, LIQUID EJECTING APPARATUS, AND METHOD OF MANUFACTURING PRESSURE BUFFERING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To solve such a problem that a deposited surface flows, thinly extended molten burrs, projected at a chamber 15 side, is formed, and cracks are generated at the thinly extended molten burrs in a substrate 6 in a pressure buffering apparatus 1 with a flexible film 4 deposited on the substrate 6. <P>SOLUTION: A pressure buffering apparatus includes: a substrate 6 having a recess 2 and an inflow communication port 3a communicated with an outer region on an inner surface of the recess 2; and a flexible film 4 bonded to an upper end surface TS of the recess 2, and closes an open end of the recess 2, and also includes a region R in which the thinly extended molten burrs, projected at the inner side rather than the inner surface SS of the recess 2 are not formed between the flexible film 4 and the upper end surface TS. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013126720(A) 申请公布日期 2013.06.27
申请号 JP20110276296 申请日期 2011.12.16
申请人 SII PRINTEK INC 发明人 KAWAMURA JUN;KOYANO TAKANORI
分类号 B41J2/175;F16J3/02;F16L9/19 主分类号 B41J2/175
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