| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a probe card with a probe structure reducing wiring layers of a multilayer wiring board in a cantilever type probe configured by laminating metal materials by MEMS technique, and to provide a manufacturing method thereof. <P>SOLUTION: A probe structure unit includes probe wiring parts at probe structures 12 for reducing wiring layers of a multilayer wiring board and is manufactured integrally. The probe structure unit includes: an arm having one end on which a needle tip portion is mounted and the other end fixed; and a probe support provided on the fixed end side of the arm. Either one of or both of the arm and the probe support has a multilayer laminate structure formed by laminating a plurality of flat sheets. A laminate layer same as the either one laminate sheet includes a probe wire for connecting the plurality of probe structures 12. <P>COPYRIGHT: (C)2013,JPO&INPIT |
