| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the same which can form a flattened insulating layer, control the thickness of the insulating layer to reduce a crosstalk phenomenon, and control an impedance value of a circuit pattern. <P>SOLUTION: A printed circuit board 100 comprises: a base substrate 110; one or more circuit patterns 120 formed on the base substrate; dummy patterns 130; and an insulating layer 140 formed on the circuit patterns and the dummy patterns. The distance D between patterns adjacent to each other among the circuit patterns and the dummy patterns satisfies the specified relation 1, where T1 represents the thickness of the circuit patterns or the dummy patterns and T2 represents the maximum thickness of the insulating layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
