发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed herein are a printed circuit board (PCB) and a method for manufacturing the same. The PCB includes a base substrate, a circuit layer formed on the base substrate and including a connection pad, a solder resist layer formed on an upper portion of the base substrate and having an opening exposing the connection pad, a metal post formed on upper portions of the connection pad and the solder resist layer and having a plurality of diameters, and a seed layer formed on the upper portion of the solder resist layer and inner walls of the opening along an interface of the metal post. |
申请公布号 |
US2013161085(A1) |
申请公布日期 |
2013.06.27 |
申请号 |
US201213402638 |
申请日期 |
2012.02.22 |
申请人 |
OH HUENG JAE;JUNG BOO YANG;LEE DAE YOUNG;CHOI JIN WON;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
OH HUENG JAE;JUNG BOO YANG;LEE DAE YOUNG;CHOI JIN WON |
分类号 |
H05K1/18;H05K3/00 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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