| 摘要 |
<P>PROBLEM TO BE SOLVED: To obstruct the spread of Sn or other metal elements from an Sn-containing electrode when it is solder-bonded using a Sn-Bi containing solder, thereby restricting deviation from the optimum composition of solder alloy. <P>SOLUTION: A manufacturing method of an electronic apparatus includes the processes of: forming a layer including a salt or a complex of a third metal element other than Sn and Bi on a first electrode of a first electronic element consisting of a metal layer whose surface contains at least Sn; coating a paste of solder alloy containing Sn and Bi on a second electrode of a second electronic element; letting the second electrode of the second electronic element contact the first electrode via the layer and the paste; and letting the solder alloy in the paste reflow and thereby electrically and mechanically joining the first and second electrodes together by a solder joint. In the reflow process, an alloy layer of Sn and the third metal element other than Sn and Bi is formed on a first boundary face between the first electrode and the solder joint. <P>COPYRIGHT: (C)2013,JPO&INPIT |
