发明名称 SOLDERING FLUX
摘要 <P>PROBLEM TO BE SOLVED: To provide a soldering flux which can sufficiently suppress the occurrence of dewetting and a solder bridge in soldering, provided that even a lead-free solder is used. <P>SOLUTION: The soldering flux includes a rosin resin, an activator and a solvent. The activator includes: (A) an amine hydrochloric acid; (B) an alicyclic polyvalent carboxylic acid or anhydride thereof; (C) an alicyclic structure-free halogenated carboxylic acid anhydride; (D) a pyrazole compound; and (E) a piperidine complex salt. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013126671(A) 申请公布日期 2013.06.27
申请号 JP20110276362 申请日期 2011.12.16
申请人 TAMURA SEISAKUSHO CO LTD 发明人
分类号 B23K35/363;B23K35/26;C22C13/00 主分类号 B23K35/363
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